Motherboard / ASUS

TUF GAMING B760-PLUS WIFI

Rp 3.650.000

Foto ASUS TUF GAMING B760-PLUS WIFI

Memeriksa pembaruan…

Compare#asus-tuf-gaming-b760-plus-wifi
Tag
motherboardasuslga1700b760ddr5tuf-gaming

Kelengkapan data · 100%

Varian: Intel B760 (ATX (305 x 244 mm))

Harga diperiksa: 2026-09-07

Sumber harga: Authorized Distributor Indonesia 2024-2026

Kelengkapan mengukur isian data, bukan kualitas perangkat. Harga dan konfigurasi perlu dicocokkan dengan sumber.

Identitas

Family SKU

Intel B760 (ATX (305 x 244 mm))

Performa

Prosesor

Intel B760 (LGA 1700), ATX (305 x 244 mm), VRM 12+1 DrMOS Power Stages (60A)

Socket CPU

LGA 1700

Chipset Kompatibel

Intel B760

Form Factor Motherboard

ATX (305 x 244 mm)

Fasa VRM & Desain Daya

12+1 DrMOS Power Stages (60A)

Konektor Daya CPU

1x 8-pin + 1x 4-pin EPS 12V

Tipe Memori (RAM)

DDR5

Jumlah Slot DIMM

4x DDR5 DIMM (Dual Channel)

Kapasitas RAM Maksimal

192 GB (4x 48 GB)

Kecepatan RAM Maksimal

DDR5-7200+ (OC) / Intel XMP 3.0

Slot Ekspansi PCIe

1x PCIe 5.0 x16 (CPU), 1x PCIe 3.0 x16 @ x4, 2x PCIe 3.0 x1

Slot M.2 NVMe

3x M.2 (all PCIe 4.0 x4 with heatsinks)

Port SATA 6Gb/s

4x SATA 6Gb/s (RAID 0, 1, 5, 10)

Port I/O Panel Belakang

1x USB 3.2 Gen 2x2 Type-C (20Gbps), 1x USB 3.2 Gen 2, 3x USB 3.2 Gen 1, 1x DisplayPort 1.4, 1x HDMI 2.1

Jaringan (LAN & Wi-Fi)

Realtek 2.5GbE LAN + Wi-Fi 6 (802.11ax) + Bluetooth 5.2

Subsistem Audio

Realtek 7.1 Surround Sound HD Audio CODEC

Fitur Kemudahan Rakit & Diagnostik

M.2 Q-Latch, Q-LED, SafeSlot Core+, TUF Protection Component Shielding

Memori

4x DDR5 DIMM (Dual Channel) DDR5, Max 192 GB (4x 48 GB) (DDR5-7200+ (OC) / Intel XMP 3.0)

Penyimpanan

3x M.2 (all PCIe 4.0 x4 with heatsinks), 4x SATA 6Gb/s (RAID 0, 1, 5, 10)

Sensor & konektivitas

Konektivitas

Realtek 2.5GbE LAN + Wi-Fi 6 (802.11ax) + Bluetooth 5.2, 1x USB 3.2 Gen 2x2 Type-C (20Gbps), 1x USB 3.2 Gen 2, 3x USB 3.2 Gen 1, 1x DisplayPort 1.4, 1x HDMI 2.1

Lainnya

Rilis

2024-01-01

Sumber harga

Authorized Distributor Indonesia 2024-2026

Harga diperbarui

2026-09-07

Buka sumber utama